Wednesday, 23 January 2019

Thermal Evaporation System

Thermal Evaporation System

Technical and Characterization Specifications:
  • It is an thin film deposition
  • The source material evaporated in a vacuum
  • In high vacuum evaporated particles can travel directly to the deposition target without colliding with the background gas
  • Backing pump Pressure : 5*10-2
  • Roughing Pressure         : 5*10-2
  • Turbo controller in pennigauge - 1*10-6
  • Quartz crystal is used to monitor the thickness of the deposited film and also to control the rate of evaporation
  • Temperature range : 250 K
  • Primary Current range: 0.81
  • Typical filament currents are 100-200Amps
  • Nitogen gas are used
  • Heating filaments/boats : Tungsten, molybdenum
  • Maximum deposition thickness that can be achieved is 600nm.
  • Substrate temperature can be increased up to 150oC .