Monday, 27 May 2019

Reactive Ion Etching System [RIE] : [Make: Hind High vacuum, INDIA]

Reactive Ion Etching System

Technical and Characterization Specifications:
  • It is a directional etching process utilizing ion bombardment to remove metals/material
  • Plasma is produced in the system by applying a strong RF [Radio frequency] electromagnetic filed to the electrode
  • Frequency range : 13.56 MHz
  • Vacuum reached at : 1 *10 -3
  • Argon, Oxygen, CF4 and SF6 Gases can be used for etching